A mechanical reliability assessment of solder joints

Author

Kishimoto, K. ; Omiya, M. ; Amagai, M.

Author_Institution

Dept. of Mech. & Control Eng., Tokyo Inst. of Technol., Japan

fYear

2001

fDate

2001

Firstpage

8

Lastpage

14

Abstract

A mechanical reliability of the solder joints is a serious concern. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it´s brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and solders (Sn-Pb solders or Sn-Ag-Cu solders), specimens of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relationships between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were examined. To investigate the stress condition on the solder joint interface, the finite element analysis was also carried out

Keywords

X-ray chemical analysis; ageing; finite element analysis; reflow soldering; reliability; scanning electron microscopy; tensile testing; EDX microprobe analysis; SEM observation; Sn-Ag-Cu; Sn-Pb; aging period; electrical pads; finite element analysis; intermetallic compounds; isothermal chamber; mechanical reliability assessment; reflow process; solder joint strength; solder joints; stress condition; tensile tests; Aging; Finite element methods; Intermetallic; Isothermal processes; Numerical analysis; Performance evaluation; Scanning electron microscopy; Soldering; Tensile stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.983948

Filename

983948