Title :
Overview of recent developments in microelectronic packaging
Author :
Chen, William T. ; Tseng, Andy
Author_Institution :
ASE (U.S.) Inc, Santa Clara, CA, USA
Abstract :
This presentation will review recent developments and future challenges in microelectronic packaging. The increase in transistor density per each generation of semiconductor technology results in demands for corresponding increase for packaging interconnection density. In meeting these demands there has been a continuous stream of new innovations and new developments in all aspects of microelectronic packaging: in materials, processing, new designs, reliability and testing, metrology, modeling and simulation
Keywords :
ball grid arrays; chip scale packaging; integrated circuit packaging; lead bonding; reviews; soldering; technological forecasting; BGA; CSP; QFN; future challenges; innovations; interface integrity; materials processing; microelectronic packaging; packaging interconnection density; recent developments; reliability; solder bump electromigration; stacked chip package; surface modification; transistor density increase; underbump metallurgy interaction; wafer level packages; wirebond pitch; wireless applications; Application software; Consumer electronics; Electronics industry; Electronics packaging; Industrial electronics; Microelectronics; Semiconductor device packaging; Technological innovation; Transistors; Wafer scale integration;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983949
