Title :
Business perspectives on MCM, MEMS and MEOMS packaging
Author :
Bauer, Charles E.
Author_Institution :
TechLead Corp., Evergreen, CO, USA
Abstract :
This paper discusses business and product level considerations for multichip packaging, micro-electro-mechanical systems (MEMS) and micro-electro-optical-mechanical systems (MEOMS) as cost effective alternatives in the design and manufacture of communications systems and telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. MCMs, MEMS and MEOMS offer unique solutions and significant system level cost savings in many applications, e.g. RF modules, antennae tuning, digital matrix functions, optical switching and product options such as security, data storage, voice recognition, etc
Keywords :
cost-benefit analysis; micro-optics; micromechanical devices; mobile radio; multichip modules; packaging; telecommunication equipment; MCMs; MEMS; MEOMS; MOEMS; RF modules; acquisition costs; antennae tuning; business considerations; communications system applications; component complexity; component functionality; cost effectiveness; data storage; digital matrix functions; functional integration; logistics costs; micro-electro-mechanical systems; micro-electro-optical-mechanical systems; miniaturization; modularization; multi-chip modules; multichip packaging; multifunctional packaging; optical switching; product design; product integration; product level considerations; product manufacture; product modularity; security; system level cost savings; telephony product applications; voice recognition; Business communication; Cost function; Logistics; Microelectromechanical systems; Micromechanical devices; Optical tuning; Packaging; Pulp manufacturing; Radio frequency; Telephony;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983951
