Title :
A study on the nucleation behavior of zinc particles on aluminum substrate [flip-chip technology]
Author :
Lee, Sung-Ki ; Jin, Jeong-Gi ; Kim, Young-Ho ; Lee, Jae-Ho
Author_Institution :
Dept. of Mater. Eng., Hanyang Univ., Seoul, South Korea
Abstract :
The nucleation and growth behavior of zinc particles deposited from the zincate solution on aluminum substrates were investigated. The zinc particles initially nucleated on the peak or edge of the aluminum surface which was exposed to the zincate solution, and preferentially grew with {0001} plane of hexagonal platelets. In case of zincate treatment on Al alloy substrate, substrate is fully covered by a thin layer of small zinc particles. At high temperature, zinc particles grew with [1100]-oriented hexagonal structure and appeared as a starfish-like shape as the coalescence of hexagonal structure
Keywords :
electroless deposition; flip-chip devices; nucleation; soldering; zinc; Al; Zn-Al; coalescence; electroless plating; facedown configuration; flip-chip technology; growth behavior; hexagonal platelets; hexagonal structure; nucleation behavior; solder bump; zincate treatment; Aluminum; Artificial intelligence; Costs; Flip chip; Morphology; Nickel; Sputtering; Surface treatment; Temperature; Zinc oxide;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983961
