A study on the nucleation behavior of zinc particles on aluminum substrate [flip-chip technology]

Author

Lee, Sung-Ki ; Jin, Jeong-Gi ; Kim, Young-Ho ; Lee, Jae-Ho

Author_Institution

Dept. of Mater. Eng., Hanyang Univ., Seoul, South Korea

fYear

2001

fDate

2001

Firstpage

73

Lastpage

78

Abstract

The nucleation and growth behavior of zinc particles deposited from the zincate solution on aluminum substrates were investigated. The zinc particles initially nucleated on the peak or edge of the aluminum surface which was exposed to the zincate solution, and preferentially grew with {0001} plane of hexagonal platelets. In case of zincate treatment on Al alloy substrate, substrate is fully covered by a thin layer of small zinc particles. At high temperature, zinc particles grew with [1100]-oriented hexagonal structure and appeared as a starfish-like shape as the coalescence of hexagonal structure

Keywords

electroless deposition; flip-chip devices; nucleation; soldering; zinc; Al; Zn-Al; coalescence; electroless plating; facedown configuration; flip-chip technology; growth behavior; hexagonal platelets; hexagonal structure; nucleation behavior; solder bump; zincate treatment; Aluminum; Artificial intelligence; Costs; Flip chip; Morphology; Nickel; Sputtering; Surface treatment; Temperature; Zinc oxide;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.983961

Filename

983961