Title :
Micromachining of Grooves for Cutting Fused Silica Plates with Femtosecond Laser Pulses
Author :
Ahmed, Farid ; Lee, Man Seop
Author_Institution :
Sch. of Eng., Inf. & Commun. Univ., Daejeon
Abstract :
Micromachining of grooves and their morphologies for cutting fused silica plates are reported in this paper. A femtosecond laser (pulse width: 172 fs, wavelength: 780 nm, and repetition rate: 1 kHz) is used to machine grooves. Ablations are investigated varying pulse energies, scanning speeds and number of consecutive passes.
Keywords :
high-speed optical techniques; laser ablation; laser beam machining; micromachining; silicon compounds; SiO2; femtosecond laser pulses; fused silica plates; groove micromachining; laser ablations; laser beam machining; time 172 fs; wavelength 780 nm; Laser ablation; Laser beam cutting; Laser beams; Micromachining; Morphology; Optical microscopy; Optical pulses; Silicon compounds; Surface emitting lasers; Ultrafast optics;
Conference_Titel :
Lasers and Electro-Optics - Pacific Rim, 2007. CLEO/Pacific Rim 2007. Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-1173-3
Electronic_ISBN :
978-1-4244-1174-0
DOI :
10.1109/CLEOPR.2007.4391473
