• DocumentCode
    2245885
  • Title

    Micromachining of Grooves for Cutting Fused Silica Plates with Femtosecond Laser Pulses

  • Author

    Ahmed, Farid ; Lee, Man Seop

  • Author_Institution
    Sch. of Eng., Inf. & Commun. Univ., Daejeon
  • fYear
    2007
  • fDate
    26-31 Aug. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Micromachining of grooves and their morphologies for cutting fused silica plates are reported in this paper. A femtosecond laser (pulse width: 172 fs, wavelength: 780 nm, and repetition rate: 1 kHz) is used to machine grooves. Ablations are investigated varying pulse energies, scanning speeds and number of consecutive passes.
  • Keywords
    high-speed optical techniques; laser ablation; laser beam machining; micromachining; silicon compounds; SiO2; femtosecond laser pulses; fused silica plates; groove micromachining; laser ablations; laser beam machining; time 172 fs; wavelength 780 nm; Laser ablation; Laser beam cutting; Laser beams; Micromachining; Morphology; Optical microscopy; Optical pulses; Silicon compounds; Surface emitting lasers; Ultrafast optics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics - Pacific Rim, 2007. CLEO/Pacific Rim 2007. Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-1173-3
  • Electronic_ISBN
    978-1-4244-1174-0
  • Type

    conf

  • DOI
    10.1109/CLEOPR.2007.4391473
  • Filename
    4391473
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2245885