A 3-D low-cost packaging technology for ceramic substrates

Author

Jillek, Werner

Author_Institution

Georg-Simon-Ohm Univ. of Appl. Sci., Nuernberg, Germany

fYear

2001

fDate

2001

Firstpage

103

Lastpage

106

Abstract

A 3-D packaging technology for ceramic substrates is described. Based on metallisation, mounting and soldering techniques, known from PCB mass production, it closes the gap between conventional thick-film hybrids and LTCCs with respect to packaging density and price. Samples manufactured on a lab scale show the potential of this technology. The reliability investigations comprise of peel off and thermal cycling tests

Keywords

adhesion; ceramic packaging; hybrid integrated circuits; integrated circuit packaging; metallisation; printed circuits; reflow soldering; substrates; surface mount technology; thick film circuits; 3D low-cost packaging technology; LTCCs; PCB mass production; RML; ceramic substrates; lab scale samples; metallisation adhesion; mounting techniques; packaging density; packaging price; peel off tests; reflow soldered multilayer technology; reliability tests; soldering techniques; thermal cycling tests; thick-film hybrids; three-dimensional ceramic packages; Ceramics; Costs; Drilling; Electronic packaging thermal management; Electronics packaging; Manufacturing; Metallization; Nonhomogeneous media; Plasma temperature; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.983967

Filename

983967