A fine pitch COG technique using eutectic Bi-Sn solder joints for LCD driver IC packaging applications

Author

Kang, Un-Byoung ; Kim, Young-Ho

Author_Institution

Div. of Mater. Sci. & Eng., Hanyang Univ., Seoul, South Korea

fYear

2001

fDate

2001

Firstpage

129

Lastpage

134

Abstract

We developed the fine pitch COG (chip on glass) technique using the eutectic Bi-Sn solder bumps for LCD driver IC packaging. The fine pitch Bi-Sn solder bumps were fabricated using the evaporation method and lift-off process and joined the metal pad on the glass substrate. The minimum pitch was 50 μm and the joining temperature was kept below 160°C. The contact resistance of the solder joint of 80 μm pitch was 19-35 mΩ, which was much lower than that of the joint made using the conventional ACF (anisotropically conductive film) bonding technique

Keywords

bismuth alloys; chip-on-board packaging; contact resistance; driver circuits; fine-pitch technology; integrated circuit interconnections; integrated circuit packaging; liquid crystal displays; tin alloys; 160 C; 19 to 35 mohm; 50 micron; 80 micron; ACF bonding technique; LCD driver IC packaging applications; anisotropically conductive film bonding technique; eutectic Bi-Sn solder joints; evaporation method; fine pitch Bi-Sn solder bumps; fine pitch COG technique; glass substrate; joining temperature; lift-off process; metal pad; minimum pitch; solder joint contact resistance; Bonding; Conductive films; Contact resistance; Flip chip; Glass; Integrated circuit packaging; Liquid crystal displays; Soldering; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.983971

Filename

983971