DocumentCode :
2246293
Title :
Transient protection for high speed data communication applications
Author :
Mason, J.S.B.
Author_Institution :
IBM UK Labs. Ltd., Winchester, UK
fYear :
1998
fDate :
35844
Firstpage :
42522
Lastpage :
42530
Abstract :
This paper is concerned with the protection of high speed data lines from damage caused by ESD and EOS (electrical overstress) transients. When a data communications network is implemented with an electrical physical layer there is a possibility of transient damage to the electronic systems. This can happen when the network is configured, through mechanisms such as ESD and cable charging, and during operation by induced transients and power supply disturbances. The problem of protecting such systems is becoming increasingly difficult as greater levels of circuit integration make the cable interface electronics more susceptible to transients and higher frequencies of operation make the system more sensitive to the electrical loading introduced by protection networks. In this paper, examples are given based on the author´s practical experience with computer disk file subsystem development, although the basic principles are relevant to many other data communication standards and applications. The growth of this sector in such areas as computer networking and data storage has focused attentions on how such systems can be protected from electrical transients
Keywords :
data communication; ESD; cable charging; cable interface electronics; computer disk file subsystem development; computer networking; data storage; electrical overstress transients; electrical transients protection; electronic systems; electrostatic discharge; high speed data communication; high speed data lines; induced transients; power supply disturbances; transient damage; transient protection;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Surges, Transients and EMC (Ref. No. 1998/184), IEE Colloquium on
Conference_Location :
London
Type :
conf
DOI :
10.1049/ic:19980006
Filename :
666471
Link To Document :
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