Title :
Chemo-thermo-viscoelastic behavior of underfill materials during curing process
Author :
Yi, Sung ; Chian, Kerm Sin
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
The mechanical properties of thermosetting underfill materials strongly depend on the curing process itself and, hence, it is important to understand the effects of temperature distributions and degree of cure on the mechanical behavior of the underfill. Moreover, the understanding of rheological changes during the curing process is essential for the manufacturing process optimization. In this paper, the chemo-thermo-rheological behavior of the underfill material during the cure process is presented. These experiments reveal the material properties dependent on temperature and degree of cure. Cure kinetics for underfill materials are determined. In addition, constitutive relations of underfill materials during curing process are presented using mechanical models with time, temperature and cure dependent parameters
Keywords :
encapsulation; flip-chip devices; heat treatment; integrated circuit packaging; microassembling; plastic packaging; reaction kinetics; rheology; thermoelasticity; viscoelasticity; chemo-thermo-rheological behavior; chemo-thermo-viscoelastic behavior; cure dependent parameters; cure kinetics; curing process; degree of cure; flip chip assembly; manufacturing process optimization; mechanical models; mechanical properties; rheological changes; temperature dependence; temperature dependent parameters; temperature distributions; thermosetting underfill materials; time dependent parameters; underfill materials; underfill mechanical behavior; Curing; Elasticity; Flip chip; Joining materials; Mechanical factors; Polymers; Resins; Rheology; Temperature dependence; Viscosity;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983994
