Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

Author

Ham, Suk-jin ; Lee, Soon-Bok

Author_Institution

CARE-Electron. Packaging Lab., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea

fYear

2001

fDate

2001

Firstpage

323

Lastpage

327

Abstract

The understanding of thermal deformation has been recognized as the key for a reliable electronic packaging design. In this study, thermal deformations of Ultra CSP^TM 80 assembly during a thermal cycling were investigated using real-time high sensitivity moire interferometry. For temperature cycling, a small-sized thermal chamber having an optical window was developed. The nominal shear strain of solder joint and the warpage of the wafer-level CSP assembly were measured under a thermal cycle

Keywords

chip scale packaging; deformation; light interferometry; moire fringes; Ultra CSP 80; electronic packaging design; nominal shear strain; optical window; real-time high sensitivity moire interferometry; small-sized thermal chamber; solder joint; thermal cycling condition; thermomechanical deformations; wafer-level CSP assembly; warpage; Assembly; Chip scale packaging; Electronic packaging thermal management; Electronics packaging; Optical interferometry; Optical sensors; Soldering; Strain measurement; Temperature sensors; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.984004

Filename

984004