DocumentCode
2246935
Title
The striated deformation of Sn solders under high frequency resonant vibration
Author
Chuang, C.M. ; Lui, T.S. ; Chen, L.H.
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2001
fDate
2001
Firstpage
328
Lastpage
334
Abstract
A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance
Keywords
cracks; deformation; dynamic testing; fracture toughness testing; soldering; Sn-Ag; Sn-Pb; Sn-Zn; coarse size; crack propagation; fine intergranular cracks; high frequency resonant vibration; striated deformation; vibration cycles; vibration energy; vibration fracture resistance; vibration test; Electronic components; Environmentally friendly manufacturing techniques; Fatigue; Immune system; Lead; Resonance; Resonant frequency; Temperature; Tin; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location
Jeju Island
Print_ISBN
0-7803-7157-7
Type
conf
DOI
10.1109/EMAP.2001.984005
Filename
984005
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