• DocumentCode
    2246935
  • Title

    The striated deformation of Sn solders under high frequency resonant vibration

  • Author

    Chuang, C.M. ; Lui, T.S. ; Chen, L.H.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    328
  • Lastpage
    334
  • Abstract
    A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance
  • Keywords
    cracks; deformation; dynamic testing; fracture toughness testing; soldering; Sn-Ag; Sn-Pb; Sn-Zn; coarse size; crack propagation; fine intergranular cracks; high frequency resonant vibration; striated deformation; vibration cycles; vibration energy; vibration fracture resistance; vibration test; Electronic components; Environmentally friendly manufacturing techniques; Fatigue; Immune system; Lead; Resonance; Resonant frequency; Temperature; Tin; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
  • Conference_Location
    Jeju Island
  • Print_ISBN
    0-7803-7157-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2001.984005
  • Filename
    984005