Title :
Micromechanical relay with electrostatic actuation
Author :
Hillerich, B. ; Kozlowski, F. ; Evers, Christine
Abstract :
Three variants of electrostatically driven microrelays are reported. The concepts of these microrelays are a cantilever beam, a fixed-fixed beam and a torsion beam with a double contact configuration. Because of the complete fabrication by surface micromachining technology, there is no need for a chip bonding process. This paper reports on the device concept, fabrication and performance of the microrelay
Keywords :
contact resistance; electrostatic devices; internal stresses; micromachining; micromechanical devices; semiconductor relays; 2 kHz; 2.6 mus; Si; SiO2-Au-SiO2; cantilever beam; contact resistance; double contact configuration; electrostatic actuation; electrostatically driven microrelays; fixed-fixed beam; mechanical switching frequency; micromechanical relay; microrelay performance; residual layer stresses; small signal applications; surface micromachining technology; switching time; torsion beam; Contacts; Electrostatic actuators; Gold; Hafnium; Micromechanical devices; Microrelays; Relays; Solid state circuits; Structural beams; Switches;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635412
