DocumentCode :
2248688
Title :
Modeling of realistic on-chip power grid using the FDTD method
Author :
Choi, Jinseong ; Wan, Lixi ; Swaminathan, Madhavan ; Beker, Ben ; Master, Raj
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
1
fYear :
2002
fDate :
19-23 Aug. 2002
Firstpage :
238
Abstract :
In this paper, a multi-layered on-chip power distribution network has been modeled using the finite difference time domain (FDTD) method. This simulation consists of 0.5 million passive elements, 40000 distributed current sources and multiple C4 vias. In this method, a branch capacitor has been used, which is different from latency insertion method (LIM). The use of the branch capacitor is important for simulating multi-layered power grids. The current in the branch capacitor is extracted from Kirchhoffs current law. This provides a good model of the branch capacitor and does not require companion models during simulation. The proposed model has been verified with SPICE through a simple example. The on-chip power grid simulation, the characteristics of noise propagation and the effectiveness of on-chip decoupling capacitors have been discussed. Also the importance of the nonlinearity in the computation of the power supply noise in on- chip power grid has been addressed through the peak noise analysis using linear current source and clock distribution network.
Keywords :
SPICE; finite difference time-domain analysis; printed circuits; FDTD method; Kirchhoff current law; SPICE; branch capacitor; clock distribution network; distributed current sources; finite difference time domain method; linear current source; multi-layered power grids; multiple C4 vias; noise propagation; on-chip power grid modelling; passive elements; peak noise analysis; power supply noise; simulation; Capacitors; Computational modeling; Delay; Finite difference methods; Kirchhoff´s Law; Network-on-a-chip; Power grids; Power systems; SPICE; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location :
Minneapolis, MN, USA
Print_ISBN :
0-7803-7264-6
Type :
conf
DOI :
10.1109/ISEMC.2002.1032481
Filename :
1032481
Link To Document :
بازگشت