Title :
Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge
Author :
Haga, Satoru ; Nakano, Ken ; Hashimoto, Osamu
Author_Institution :
Assoc. of Super-Adv. Electron. Technol., Ibaraki, Japan
Abstract :
Power-ground plane resonance of multi-layer PCB causes a large amount of emission from the edges of power-ground plane. To reduce the emission, symmetrical power-ground layer stack-up PCBs with no open edge have been developed. The symmetrical boards significantly reduce the emission to almost no peak and additionally have the great advantages of signal integrity and packaging density.
Keywords :
electromagnetic interference; interference suppression; printed circuits; ground plane resonance; multi-layer PCB; packaging density; power plane resonance; power-ground plane resonance; radiated emission; signal integrity; symmetrical layer stack-up; symmetrical power-ground layer stack-up PCBs; thinner dielectric effects; Clocks; Connectors; Density measurement; Dielectric losses; Dielectric measurements; Frequency; Packaging; Power measurement; Resonance; Signal generators;
Conference_Titel :
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location :
Minneapolis, MN, USA
Print_ISBN :
0-7803-7264-6
DOI :
10.1109/ISEMC.2002.1032486
