• DocumentCode
    2248964
  • Title

    Simulation of light scatter from defects in EUV mask blanks

  • Author

    Ito, M. ; Ogawa, T. ; Nishiyama, I. ; Okazaki, S.

  • Author_Institution
    EUV Lithography Lab., Assoc. of Super-Advanced Electron. Technol., Atsugi, Japan
  • fYear
    2001
  • fDate
    Oct. 31 2001-Nov. 2 2001
  • Firstpage
    86
  • Lastpage
    87
  • Abstract
    Using light scatter simulations, we have predicted the PSL-equivalent sensitivity needed for mask blank inspection. The simulation procedure has two steps. First, the electromagnetic field scattered off a feature is calculated by solving Maxwell´s equations with a time-domain finite-element method. Then, the resultant near field is extrapolated to the far field using the Kirchhoff diffraction formula. We performed two-dimensional simulations at a wavelength of 488 nm (Ar laser). The mask blank is illuminated by an s-polarized plane wave at normal incidence. We also discuss the angular distribution of scattered intensity, as well as the effects of incident angle and wavelength on light scattering.
  • Keywords
    Maxwell equations; finite element analysis; inspection; light scattering; masks; semiconductor process modelling; time-domain analysis; ultraviolet lithography; 488 nm; Ar laser; EUV mask blanks; Kirchhoff diffraction formula; Maxwell equations; PSL-equivalent sensitivity; defects; electromagnetic field scattering; incident angle; light scatter simulations; mask blank inspection; near field extrapolation; s-polarized plane wave; scattered intensity angular distribution; time-domain finite-element method; two-dimensional simulations; Argon; Electromagnetic diffraction; Electromagnetic fields; Electromagnetic scattering; Finite element methods; Inspection; Light scattering; Maxwell equations; Predictive models; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology Conference, 2001 International
  • Conference_Location
    Shimane, Japan
  • Print_ISBN
    4-89114-017-8
  • Type

    conf

  • DOI
    10.1109/IMNC.2001.984093
  • Filename
    984093