DocumentCode
2248964
Title
Simulation of light scatter from defects in EUV mask blanks
Author
Ito, M. ; Ogawa, T. ; Nishiyama, I. ; Okazaki, S.
Author_Institution
EUV Lithography Lab., Assoc. of Super-Advanced Electron. Technol., Atsugi, Japan
fYear
2001
fDate
Oct. 31 2001-Nov. 2 2001
Firstpage
86
Lastpage
87
Abstract
Using light scatter simulations, we have predicted the PSL-equivalent sensitivity needed for mask blank inspection. The simulation procedure has two steps. First, the electromagnetic field scattered off a feature is calculated by solving Maxwell´s equations with a time-domain finite-element method. Then, the resultant near field is extrapolated to the far field using the Kirchhoff diffraction formula. We performed two-dimensional simulations at a wavelength of 488 nm (Ar laser). The mask blank is illuminated by an s-polarized plane wave at normal incidence. We also discuss the angular distribution of scattered intensity, as well as the effects of incident angle and wavelength on light scattering.
Keywords
Maxwell equations; finite element analysis; inspection; light scattering; masks; semiconductor process modelling; time-domain analysis; ultraviolet lithography; 488 nm; Ar laser; EUV mask blanks; Kirchhoff diffraction formula; Maxwell equations; PSL-equivalent sensitivity; defects; electromagnetic field scattering; incident angle; light scatter simulations; mask blank inspection; near field extrapolation; s-polarized plane wave; scattered intensity angular distribution; time-domain finite-element method; two-dimensional simulations; Argon; Electromagnetic diffraction; Electromagnetic fields; Electromagnetic scattering; Finite element methods; Inspection; Light scattering; Maxwell equations; Predictive models; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location
Shimane, Japan
Print_ISBN
4-89114-017-8
Type
conf
DOI
10.1109/IMNC.2001.984093
Filename
984093
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