Title :
Flexible microchannels with integrated nanoporous membranes for filtration and separation of molecules and particles
Author :
Metz, S. ; Trautmann, C. ; Bertsch, A. ; Renaud, P.
Author_Institution :
Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Abstract :
This paper reports on the technology development and characterization of polyimide-based, microfluidic channels with integrated nanoporous membranes. A layer transfer and lamination technique is used to fabricate flexible microchannels from spin-on polyimide. The microfluidic channels can be operated at high pressures and flow rates without leakage. Nanopores are created in the polyimide channel walls by irradiation with swift heavy ions and subsequent chemical etching of the ion tracks. The irradiation and etching parameters can be used to adjust pore density (by ion fluence) and pore length (via ion energy). The track etching conditions, such as pH-value, concentration, temperature and etch time, define the pore diameter and pore geometry. Typical diameters of cylindrical pores range from 10 nm to 1 or 2 /spl mu/m. The devices can be used for cross-flow filtration of particles and molecules in fluids or as bio-implants for drug delivery.
Keywords :
drug delivery systems; etching; filtration; ion beam effects; membranes; microfluidics; polymer films; porous materials; separation; 10 nm to 2 micron; bioimplants; chemical etching; cross-flow particle filtration; cylindrical pores; drug delivery; etch time; flexible microchannels; high pressures; integrated nanoporous membranes; ion energy; ion fluence; ion tracks; lamination technique; layer transfer; molecule separation; nanopores; pH-value; polyimide-based microfluidic channels; pore density; pore diameter; pore geometry; pore length; spin-on polyimide; swift heavy ion irradiation; track etching conditions; Biomembranes; Chemicals; Etching; Geometry; Lamination; Microchannel; Microfluidics; Nanoporous materials; Polyimides; Temperature;
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-7185-2
DOI :
10.1109/MEMSYS.2002.984095