DocumentCode :
2249045
Title :
Design, fabrication and characterization of an integrated micro heat pipe
Author :
Man Lee ; Man Wong ; Zohar, Y.
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear :
2002
fDate :
24-24 Jan. 2002
Firstpage :
85
Lastpage :
88
Abstract :
The design, fabrication and characterization of an integrated microsystem consisting of micro heat pipes, a micro heater, temperature and capacitive microsensors are presented. CMOS-compatible micromachining techniques are utilized to fabricate the micro heat pipe device capped by a nitride layer. In order to allow clear visualization of flow patterns during operation, the process has been modified using a glass wafer to cap the heat pipes. Temperature distributions along the micro heat pipes have been measured using the microsensors located next to the heat pipes. The capacitive microsensors have been used to measure the void-fraction, taking advantage of the large difference between the dielectric constants of the liquid and vapor phases.
Keywords :
CMOS integrated circuits; capacitive sensors; cooling; flow visualisation; heat pipes; integrated circuit bonding; micromachining; micromechanical devices; microsensors; temperature distribution; temperature sensors; CMOS-compatible micromachining techniques; capacitive microsensors; electronic component cooling; flow pattern visualization; glass bonding; glass wafer capping; integrated microsystem; liquid phase dielectric constant; micro heat pipes; micro heater; microchannel array; nitride layer capping; temperature distributions; temperature microsensors; vapor phase dielectric constant; void-fraction measurement; CMOS technology; Etching; Fabrication; Glass; Heat engines; Microsensors; Resistance heating; Thermal conductivity; Wafer bonding; Water heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-7185-2
Type :
conf
DOI :
10.1109/MEMSYS.2002.984096
Filename :
984096
Link To Document :
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