• DocumentCode
    2249045
  • Title

    Design, fabrication and characterization of an integrated micro heat pipe

  • Author

    Man Lee ; Man Wong ; Zohar, Y.

  • Author_Institution
    Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2002
  • fDate
    24-24 Jan. 2002
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    The design, fabrication and characterization of an integrated microsystem consisting of micro heat pipes, a micro heater, temperature and capacitive microsensors are presented. CMOS-compatible micromachining techniques are utilized to fabricate the micro heat pipe device capped by a nitride layer. In order to allow clear visualization of flow patterns during operation, the process has been modified using a glass wafer to cap the heat pipes. Temperature distributions along the micro heat pipes have been measured using the microsensors located next to the heat pipes. The capacitive microsensors have been used to measure the void-fraction, taking advantage of the large difference between the dielectric constants of the liquid and vapor phases.
  • Keywords
    CMOS integrated circuits; capacitive sensors; cooling; flow visualisation; heat pipes; integrated circuit bonding; micromachining; micromechanical devices; microsensors; temperature distribution; temperature sensors; CMOS-compatible micromachining techniques; capacitive microsensors; electronic component cooling; flow pattern visualization; glass bonding; glass wafer capping; integrated microsystem; liquid phase dielectric constant; micro heat pipes; micro heater; microchannel array; nitride layer capping; temperature distributions; temperature microsensors; vapor phase dielectric constant; void-fraction measurement; CMOS technology; Etching; Fabrication; Glass; Heat engines; Microsensors; Resistance heating; Thermal conductivity; Wafer bonding; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7185-2
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2002.984096
  • Filename
    984096