DocumentCode :
2249065
Title :
Enhanced nucleate boiling in microchannels
Author :
Lian Zhang ; Wang, E.N. ; Jae-Mo Koo ; Linan Jiang ; Goodson, K.E. ; Santiago, J.G. ; Kenny, T.W.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., CA, USA
fYear :
2002
fDate :
24-24 Jan. 2002
Firstpage :
89
Lastpage :
92
Abstract :
This paper studies the nucleate boiling conditions and mechanisms in plasma etched silicon microchannels below 150 /spl mu/m hydraulic diameter. Boiling regimes and the wall superheat in microchannels with various DI water surface tensions and wall surface roughness are discussed. The experiments show that wall superheat in microchannels is primarily due to the lack of active nucleation sites rather than limited channel space or a high liquid surface tension. By creating small cavities in the channel walls, superheat can be eliminated from as small as 28 /spl mu/m hydraulic diameter silicon channels.
Keywords :
boiling; channel flow; cooling; elemental semiconductors; heat exchangers; microfluidics; nucleation; silicon; sputter etching; surface tension; surface topography; two-phase flow; 28 to 150 micron; DI water surface tension; Si; active nucleation sites; boiling regimes; channel wall cavities; gas-trapping cavities; high power IC cooling; hydraulic diameter; nucleate boiling conditions; plasma etched Si microchannels; superheat elimination; two-phase microchannel heat exchanger; wall superheat; wall surface roughness; Embryo; Etching; Microchannel; Plasma applications; Plasma measurements; Plasma temperature; Rough surfaces; Silicon; Surface roughness; Surface tension;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-7185-2
Type :
conf
DOI :
10.1109/MEMSYS.2002.984097
Filename :
984097
Link To Document :
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