Uniformity in patterns imprinted using photo-curable liquid polymer

Author

Hiroshima, H. ; Komuro, M. ; Inoue, S. ; Kasahara, N. ; Taniguchi, J. ; Miyamoto, I.

Author_Institution

Adv. Semicond. Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan

fYear

2001

fDate

Oct. 31 2001-Nov. 2 2001

Firstpage

102

Lastpage

103

Abstract

Imprint lithography reported by Chou et al (Appl. Phys. Lett. vol. 67, p. 3114, 1995) may become one of the most promising lithographic technologies in terms of mass-production and low equipment cost . In particular, those based on photo-induced solidification (Haisma et al, 1996; Bailey et al, 2000) are very attractive because of elimination of heat-up and cool-down time and the possibility of a step and repeat procedure. We have already reported preliminary results (Komuro et al, Jpn. J. Appl. Phys., vol. 39, p. 7075, 2000) by imprint using liquid polymer curable by ultra-violet (UV) light exposure. The paper shows the pattern fabrication process by imprint using photo-curable liquid polymer. The base layer, which is accompanied with a press process, must be removed by etching. In this paper, we describe uniformity in imprinted patterns and reproducibility of our imprint process.

Keywords

dielectric liquids; etching; integrated circuit technology; lithography; optical polymers; ultraviolet radiation effects; UV light exposure; base layer removal; cool-down time; equipment cost; etching process; heat-up time; imprint lithography; imprint process; imprinted pattern reproducibility; imprinted pattern uniformity; lithographic technology; mass-production; pattern fabrication process; photo-curable liquid polymer; photo-induced solidification; press process; step-and-repeat procedure; ultra-violet light exposure; Degradation; Etching; Fabrication; Lithography; Polymers; Reproducibility of results; Silicon; Substrates; Testing; Thickness control;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 2001 International

Conference_Location

Shimane, Japan

Print_ISBN

4-89114-017-8

Type

conf

DOI

10.1109/IMNC.2001.984109

Filename

984109