Title :
Uniformity in patterns imprinted using photo-curable liquid polymer
Author :
Hiroshima, H. ; Komuro, M. ; Inoue, S. ; Kasahara, N. ; Taniguchi, J. ; Miyamoto, I.
Author_Institution :
Adv. Semicond. Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki, Japan
fDate :
Oct. 31 2001-Nov. 2 2001
Abstract :
Imprint lithography reported by Chou et al (Appl. Phys. Lett. vol. 67, p. 3114, 1995) may become one of the most promising lithographic technologies in terms of mass-production and low equipment cost . In particular, those based on photo-induced solidification (Haisma et al, 1996; Bailey et al, 2000) are very attractive because of elimination of heat-up and cool-down time and the possibility of a step and repeat procedure. We have already reported preliminary results (Komuro et al, Jpn. J. Appl. Phys., vol. 39, p. 7075, 2000) by imprint using liquid polymer curable by ultra-violet (UV) light exposure. The paper shows the pattern fabrication process by imprint using photo-curable liquid polymer. The base layer, which is accompanied with a press process, must be removed by etching. In this paper, we describe uniformity in imprinted patterns and reproducibility of our imprint process.
Keywords :
dielectric liquids; etching; integrated circuit technology; lithography; optical polymers; ultraviolet radiation effects; UV light exposure; base layer removal; cool-down time; equipment cost; etching process; heat-up time; imprint lithography; imprint process; imprinted pattern reproducibility; imprinted pattern uniformity; lithographic technology; mass-production; pattern fabrication process; photo-curable liquid polymer; photo-induced solidification; press process; step-and-repeat procedure; ultra-violet light exposure; Degradation; Etching; Fabrication; Lithography; Polymers; Reproducibility of results; Silicon; Substrates; Testing; Thickness control;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location :
Shimane, Japan
Print_ISBN :
4-89114-017-8
DOI :
10.1109/IMNC.2001.984109