• DocumentCode
    2249719
  • Title

    Graphene devices, interconnect and circuits — challenges and opportunities

  • Author

    Stan, Mircea R. ; Unluer, Dincer ; Ghosh, Avik ; Tseng, Frank

  • Author_Institution
    ECE Dept., Univ. of Virginia, Charlottesville, VA, USA
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    69
  • Lastpage
    72
  • Abstract
    Graphene has recently emerged as a serious contender for the post silicon era. Graphene nanoribbon (GNR) devices have similar performance characteristics to carbon nanotube (CNT) ones. However, lithographic patterning methods applied to graphene can avoid the degree of chirality control and alignment issues typical of CNTs, and GNR devices and GNR interconnect can in principle be seamlessly obtained by patterning single graphene sheets, thus leading to monolithically device-interconnect structures. Electrically doped GNR devices in series and in parallel can be used for creating complex GNR FET digital circuits. There are also several important challenges facing the graphene ldquobrave new world,rdquo but many of the difficulties hopefully will have tractable solutions. This paper examines the topic of GNR FET circuit design from a bottom-up theoretical perspective, starting with GNR device and interconnect modeling and simulation, while trying to reconcile theory with some recent experimental results.
  • Keywords
    carbon nanotubes; digital circuits; field effect transistors; interconnections; lithography; molecular electronics; GNR FET digital circuit; carbon nanotube; circuit design; graphene devices; graphene nanoribbon devices; interconnect modeling; lithographic patterning method; monolithic device-interconnect structure; reconcile theory; Boundary conditions; Circuit simulation; Digital circuits; Electric variables; FET circuits; Integrated circuit interconnections; Lattices; Nanoscale devices; Photonic band gap; Silicon; CNT; GNR; carbon nanotubes; graphene nanoribbons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5117687
  • Filename
    5117687