DocumentCode :
2249723
Title :
Rigorous simulation of line-defects in EUV masks
Author :
Schiavone, P. ; Payerne, R.
Author_Institution :
Lab. des Technol. de la Microelectronique, CNRS, Grenoble, France
fYear :
2001
fDate :
Oct. 31 2001-Nov. 2 2001
Firstpage :
126
Abstract :
Summary form only given. We use rigorous electromagnetic simulation to investigate the behaviour of EUV defective masks. Using the Fourier modal method, the geometry of the structure as well as the polarisation state can be handled (in 2D in the current version of the code). The speed of our simulation allows us to make an evaluation of the problem of the defects without making too restrictive hypotheses (for example, on the number of layers or on the layer geometry). A very simple analytical model has been developed in order to generate the input geometry for the simulations. The deposition conditions can be mimicked by changing an empirical parameter representing the planarisation properties of the process.
Keywords :
Fourier analysis; masks; semiconductor process modelling; ultraviolet lithography; EUV masks; Fourier modal method; absorber feature; analytical model; deposition conditions; layer geometry; line defects; multilayer mirror; planarisation properties; polarisation state; rigorous electromagnetic simulation; Analytical models; Circuit simulation; Electronic mail; Integrated circuit technology; Nonhomogeneous media; Planarization; Solid modeling; Ultraviolet sources;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location :
Shimane, Japan
Print_ISBN :
4-89114-017-8
Type :
conf
DOI :
10.1109/IMNC.2001.984121
Filename :
984121
Link To Document :
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