• DocumentCode
    2249817
  • Title

    Managing an EMC engineering and testing organization

  • Author

    Staggs, David

  • Author_Institution
    Dell Comput. Corp., Round Rock, TX, USA
  • Volume
    1
  • fYear
    2002
  • fDate
    19-23 Aug. 2002
  • Firstpage
    519
  • Abstract
    Managing an EMC engineering and testing organization is getting increasingly difficult. As more IEC and CISPR standards are generated, and as the number of product tests increase, the compliance process is becoming more complex. There are increasing numbers of countries that are "rapid adopters" of IEC and CISPR standards. Countries adopt these standards and then place their own unique set of requirements around them. EMC design and test organizations have to deal with an ever changing and expanding set of requirements for an increasing number of countries. Combining these changes with the rapid evolution in computer technology, we find EMC compliance becoming a critical path issue for new product releases. EMC compliance of products can easily become a "time-to-market" issue for many companies if processes, tools, design skills and test capabilities are not effective and efficient. This paper describes how an EMC organization can deal with all these changes, including increased process complexity, and still produce a high quality and repeatable test result.
  • Keywords
    IEC standards; electromagnetic compatibility; immunity testing; management; CISPR standards; EMC compliance process; EMC design and test organizations; EMC engineering and testing organization management; IEC standards; computer technology; critical path issue; new product releases; product tests; time-to-market issue; Computer industry; Costs; Design engineering; Electromagnetic compatibility; Engineering management; FCC; IEC standards; Personnel; Postal services; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
  • Conference_Location
    Minneapolis, MN, USA
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.2002.1032534
  • Filename
    1032534