DocumentCode
2250295
Title
Web-based concurrent design with product information markup language
Author
Lee, C.K.M. ; Lau, H.C.W. ; Yu, K.M.
Author_Institution
Dept. of Ind. & Syst. Eng., Hong Kong Polytech. Univ., Kowloon, China
fYear
2003
fDate
24-25 April 2003
Firstpage
119
Lastpage
125
Abstract
Today´s manufacturers provide integrated product process development from product design, production and finally to marketing and sales. The whole product life cycle contains lots of data where product data management is crucial for making use of update information to facilitate collaborative product commerce. A product data exchange standard, product information markup language, which is composed a set of well defined XML schema, is introduced to provide a flexible way to encode structured data into a format. In order to response to the rapid change of production environment or market trend, the intelligent operation is embedded in PIML such that it can provide advice for the design engineers to resolve the engineering problem and minimize the ripple effect caused by sudden changes. The intelligent operation is an artificial intelligent problem solving technique, case based reasoning, which retrieves the past most similar case by weighting various problem parameter and then adapts the past solution for the novel problem. A prototype system is developed and is proposed for applying in electroplating industry.
Keywords
Internet; XML; case-based reasoning; concurrent engineering; product design; product development; Web-based concurrent design; XML schema; artificial intelligent problem solving technique; case based reasoning; collaborative product commerce; electroplating industry; product data management; product information markup language; product process development; prototype system; Artificial intelligence; Business; Collaboration; Design engineering; Manufacturing processes; Marketing and sales; Markup languages; Product design; Production; XML;
fLanguage
English
Publisher
ieee
Conference_Titel
Systems and Information Engineering Design Symposium, 2003 IEEE
Print_ISBN
0-9744559-0-3
Type
conf
DOI
10.1109/SIEDS.2003.158014
Filename
1242409
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