DocumentCode :
2250527
Title :
Mew diode string design with very low leakage current for using in power supply ESD clamp circuits
Author :
Ker, Ming-Dou ; Lo, Wen-Yu ; Chang, Hun-Hsien
Author_Institution :
Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
5
fYear :
2000
fDate :
2000
Firstpage :
69
Abstract :
A new diode string design with very low leakage current is proposed for using in the on-chip power supply ESD (electrostatic discharge) clamp circuits. Three traditional designs of the stacked diode strings used in the power supply ESD clamp circuits are also fabricated in the same test chip to verify the improvement of this new design. By adding an NMOS-controlled lateral SCR (NCLSCR) device into the stacked diode string, the leakage current of this new proposed diode string with 6 stacked diodes under a 5 V (3.3 V) forward bias condition can be controlled below 2.1 (1.07) nA at an environment temperature of 125°C. The blocking voltage of this new diode string design with NCLSCR can be linearly adjusted by simply changing the number of the stacked diodes in the diode string for application across the power lines with different voltage levels to achieve a whole-chip ESD protection scheme
Keywords :
CMOS integrated circuits; electrostatic discharge; integrated circuit design; leakage currents; low-power electronics; mixed analogue-digital integrated circuits; protection; semiconductor diodes; thyristors; 0.35 micron; 1.07 to 2.1 nA; 125 C; 3.3 to 5 V; NMOS-controlled lateral SCR device; blocking voltage adjustment; diode string design; electrostatic discharge clamp circuits; low leakage current; mixed-mode CMOS ICs; onchip ESD clamp circuits; power supply ESD clamp circuits; silicided CMOS process; stacked diode strings; Circuit testing; Clamps; Diodes; Electrostatic discharge; Leakage current; Power supplies; Protection; Temperature control; Thyristors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
Conference_Location :
Geneva
Print_ISBN :
0-7803-5482-6
Type :
conf
DOI :
10.1109/ISCAS.2000.857365
Filename :
857365
Link To Document :
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