Title :
A MEMS micromagnetic actuator for use in a bionic interface
Author :
Chowdhury, Sazzadur ; Jullien, G.A. ; Ahmadi, M.A. ; Miller, W.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Windsor Univ., Ont., Canada
Abstract :
The design of a microelectromechanical (MEMS) device that forms part of a micro acousto-magnetic transducer for use with a hearing instrument is described in this paper. A MEMS realization of a microelectromagnetic actuator is used to generate a magnetic field that exerts a force on a permanent micromagnet that has been implanted on the round window of the cochlea. The motion of the implanted magnet will develop traveling waves on the basilar membrane inside the cochlea to give a hearing capability. A modular realization of the micro electromagnet has been proposed that offers the advantage that the magnet´s magnetomotive force performance characteristics can be easily changed by depositing additional layers of the modular realization for the magnet core segments and their associated section of excitation winding. The MEMS structures have been designed and simulated using the IntelliSuite MEMS software package from the IntelliSense Corporation
Keywords :
acoustic transducers; hearing aids; magnetic forces; magnetoacoustic effects; microactuators; prosthetics; IntelliSense Corporation; IntelliSuite MEMS software package; MEMS micromagnetic actuator; basilar membrane; bionic interface; cochlea implantation; cochlea round window; excitation winding; hearing instrument; implanted magnet motion; magnet core segments; magnetic field generation; magnetomotive force performance; micro acousto-magnetic transducer; microelectromagnetic actuator; microelectromechanical device design; modular realization; permanent micromagnet; traveling waves; Acoustic transducers; Actuators; Auditory system; Biomembranes; Electromagnets; Instruments; Magnetic cores; Magnetic fields; Micromagnetics; Micromechanical devices;
Conference_Titel :
Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
Conference_Location :
Geneva
Print_ISBN :
0-7803-5482-6
DOI :
10.1109/ISCAS.2000.857393