Title :
Fluidic self-assembly of semiconductor devices: a promising new method of mass producing flexible circuitry
Author_Institution :
Alien Technol. Corp., Morgan Hill, CA, USA
fDate :
Oct. 31 2001-Nov. 2 2001
Abstract :
We review the basics of fluidic self-assembly, some recent processing developments, and some of the applications of this technology. In particular, we discuss the shape of the NanoBlock/sup TM/ IC devices used in FSA/sup TM/ processing, present a brief overview of the versatility of our process, and outline both a current process application and some future potential applications.
Keywords :
integrated circuit manufacture; microfluidics; nanotechnology; self-assembly; FSA processing; IC electronics; NanoBlock IC devices; backplane integration; flexible circuitry mass production; fluidic self-assembly; plastic backplanes; processing developments; semiconductor devices; smart cards; Assembly; Backplanes; Displays; Integrated circuit technology; Nanoscale devices; Plastics; Self-assembly; Semiconductor devices; Shape; Substrates;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location :
Shimane, Japan
Print_ISBN :
4-89114-017-8
DOI :
10.1109/IMNC.2001.984186
