• DocumentCode
    2251516
  • Title

    Impacts of NBTI and PBTI on power-gated SRAM with high-k metal-gate devices

  • Author

    Yang, Hao-I ; Chuang, Ching-Te ; Hwang, Wei

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    377
  • Lastpage
    380
  • Abstract
    The threshold voltage (VT) drift induced by negative bias temperature instability (NBTI) weakens PFETs, while positive bias temperature instability (PBTI) weakens NFETs fabricated with high-k metal-gate, respectively. These long-term VT drifts degrade SRAM cell stability, margin and performance, and may lead to functional failure over the life of usage. Additionally, most state-of-the-art SRAMs are designed with power-gating structures to reduce leakage currents in Standby or Sleep mode, and the power switches suffer NBTI or PBTI stress/degradation as well. This paper presents a comprehensive analysis on the impacts of NBTI and PBTI on power-gated SRAM arrays with high-k metal-gate devices. NBTI/PBTI tolerant sense amplifier structures are also discussed.
  • Keywords
    SRAM chips; amplifiers; NBTI; PBTI; high-k metal-gate devices; negative bias temperature instability; positive bias temperature instability; power-gated SRAM; power-gating structures; threshold voltage drift; tolerant sense amplifier structures; Degradation; High K dielectric materials; High-K gate dielectrics; Lead; Negative bias temperature instability; Niobium compounds; Random access memory; Stability; Threshold voltage; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5117764
  • Filename
    5117764