DocumentCode
2251516
Title
Impacts of NBTI and PBTI on power-gated SRAM with high-k metal-gate devices
Author
Yang, Hao-I ; Chuang, Ching-Te ; Hwang, Wei
Author_Institution
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear
2009
fDate
24-27 May 2009
Firstpage
377
Lastpage
380
Abstract
The threshold voltage (VT) drift induced by negative bias temperature instability (NBTI) weakens PFETs, while positive bias temperature instability (PBTI) weakens NFETs fabricated with high-k metal-gate, respectively. These long-term VT drifts degrade SRAM cell stability, margin and performance, and may lead to functional failure over the life of usage. Additionally, most state-of-the-art SRAMs are designed with power-gating structures to reduce leakage currents in Standby or Sleep mode, and the power switches suffer NBTI or PBTI stress/degradation as well. This paper presents a comprehensive analysis on the impacts of NBTI and PBTI on power-gated SRAM arrays with high-k metal-gate devices. NBTI/PBTI tolerant sense amplifier structures are also discussed.
Keywords
SRAM chips; amplifiers; NBTI; PBTI; high-k metal-gate devices; negative bias temperature instability; positive bias temperature instability; power-gated SRAM; power-gating structures; threshold voltage drift; tolerant sense amplifier structures; Degradation; High K dielectric materials; High-K gate dielectrics; Lead; Negative bias temperature instability; Niobium compounds; Random access memory; Stability; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3827-3
Electronic_ISBN
978-1-4244-3828-0
Type
conf
DOI
10.1109/ISCAS.2009.5117764
Filename
5117764
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