Title :
Measurement of adhesive force between mold and photo-curable resin in imprint technology
Author :
Taniguchi, J. ; Kawasaki, T. ; Tokano, Y. ; Kogo, Y. ; Miyamoto, I. ; Komuro, M. ; Hiroshima, H. ; Sakai, N. ; Tada, K.
Author_Institution :
Dept. of Appl. Electron., Tokyo Univ. of Sci., Chiba, Japan
fDate :
Oct. 31 2001-Nov. 2 2001
Abstract :
Imprint lithography using photocurable resin is the most promising technique compared with other imprint lithography techniques, because it can complete a pattern transfer at room temperature. Thus, it would be able to implement practical mass-production lithography. In a previous report, however, a part of the solidified polymer was ripped away, because of strong adhesive force between the mold and solidified polymer. In order to improve this phenomenon, release coating of quartz mold and development of a photocurable resin are necessary. In this paper, we describe a measurement method of adhesive force between mold and resin using a tensile tester and, furthermore, durability of release coating material.
Keywords :
adhesion; force measurement; integrated circuit measurement; tensile testing; ultraviolet lithography; UV dose; adhesive force; durability; imprint lithography; imprint technology; mass-production lithography; pattern transfer; photocurable resin; quartz mold; release coating; tensile tester; Area measurement; Coatings; Force measurement; Industrial electronics; Lithography; Materials science and technology; Polymers; Resins; Surface treatment; Testing;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location :
Shimane, Japan
Print_ISBN :
4-89114-017-8
DOI :
10.1109/IMNC.2001.984208
