Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB

This paper investigates, in both time and frequency domains, the power plane noise coupling to signal trace with via transition in multi-layer PCB. Power plane noise or ground bounce noise will cause power plane resonance, and it also couples noise to signal traces with via transition through power planes. Separating power planes with slits is effective in reducing noise coupling at high frequency but a new resonant mode will be excited at lower frequency. The current distribution pattern of this new resonant mode between power planes helps one to understand this phenomenon more clearly. In this work, there is good agreement between the numerical prediction by the FDTD method and measurement results.