• DocumentCode
    2252504
  • Title

    A 1 GHz CMOS transimpedance amplifier for chip-to-chip optical interconnects

  • Author

    Haralabidis, N. ; Katsafouros, S. ; Halkias, G.

  • Author_Institution
    Inst. of Microelectron. NCSR Demokritos, Athens, Greece
  • Volume
    5
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    421
  • Abstract
    A CMOS transimpedance amplifier (TIA) has been designed and tested for cost effective chip-to-chip optical interconnects. The amplifier is based on a foundry standard CMOS technology which features 0.8 μm drawn channel length, double-poly capacitors and poly-Si resistors. Measurements showed a transimpedance gain of 48 dBΩ over a -3 dB bandwidth of DC-1 GHz and a power consumption of 80 mW when biased at +5 V and AC coupled to the load. The biasing circuitry consumes an additional 52 mW. The mean input referred noise current density was calculated to be 7.4pA/√Hz, which results in an input optical sensitivity of -25.7 dBm for a BER of 10-9. The experimental results verify to a great extent the expected transmission rate of up to 1.8 Gbps
  • Keywords
    CMOS analogue integrated circuits; DC amplifiers; circuit optimisation; circuit simulation; current mirrors; integrated circuit noise; optical interconnections; 0.8 micron; 1 GHz; 1.8 Gbit/s; 5 V; 80 mW; CMOS transimpedance amplifier; biasing circuitry; chip-to-chip optical interconnects; double-poly capacitors; drawn channel length; expected transmission rate; foundry standard CMOS technology; input optical sensitivity; mean input referred noise current density; polysilicon resistors; power consumption; CMOS technology; Costs; Foundries; Optical amplifiers; Optical design; Optical interconnections; Optical sensors; Semiconductor optical amplifiers; Stimulated emission; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2000. Proceedings. ISCAS 2000 Geneva. The 2000 IEEE International Symposium on
  • Conference_Location
    Geneva
  • Print_ISBN
    0-7803-5482-6
  • Type

    conf

  • DOI
    10.1109/ISCAS.2000.857461
  • Filename
    857461