Title :
Single-chip condenser miniature microphone with a high sensitive circular corrugated diaphragm
Author :
Jing Chen ; Litian Liu ; Zhijian Li ; Zhimin Tan ; Yang Xu ; Jun Ma
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
A novel single-chip condenser miniature microphone with a circular corrugated diaphragm for residual stress releasing has been proposed, fabricated and tested. The condenser microphone consists of a rigid single-crystal backplate and a flexible circular corrugated diaphragm using induced couple plasma (ICP) etching. An electrostatic-structural coupling finite element analysis (FEA) was performed for design optimization. A sensitivity of 40 mv/Pa up to 15 KHz has been achieved under a low bias voltage of 14 V, which is among the best in the presented reports.
Keywords :
diaphragms; finite element analysis; internal stresses; microphones; sputter etching; 14 V; 5 kHz; circular corrugated diaphragm; design optimization; electrostatic-structural coupling finite element analysis; induced couple plasma etching; residual stress; single-chip condenser miniature microphone; single-crystal backplate; Design optimization; Electrostatic analysis; Etching; Finite element methods; Low voltage; Microphones; Performance analysis; Plasma applications; Residual stresses; Testing;
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-7185-2
DOI :
10.1109/MEMSYS.2002.984258
