DocumentCode

2253286

Title

Automatic wedge bonding with ribbon wire for high frequency applications

Author

Qin, Ivy Wei ; Reid, Paul ; Werner, Robert E. ; Doerr, David

Author_Institution

Kulicke & Soffa

fYear

2002

fDate

17-18 July 2002

Firstpage

97

Lastpage

104

Keywords

Bonding forces; Bonding processes; Frequency; Gallium arsenide; Microwave devices; Packaging; Skin effect; Temperature sensors; US Department of Energy; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International

Conference_Location

San Jose, CA, USA

Print_ISBN

0-7803-7301-4

Type

conf

DOI

10.1109/IEMT.2002.1032732

Filename

1032732