• DocumentCode
    2253287
  • Title

    Power grid voltage integrity verification

  • Author

    Nizam, Maha ; Najm, Farid N. ; Devqan, A.

  • Author_Institution
    Dept. of Electr. 7 Comput. Eng., Toronto Univ., Ont., Canada
  • fYear
    2005
  • fDate
    8-10 Aug. 2005
  • Firstpage
    239
  • Lastpage
    244
  • Abstract
    Full-chip verification requires one to check if the power grid is safe, i.e., if the voltage drop on the grid does not exceed a certain threshold. The traditional simulation-based solution to this problem is computationally expensive, because of the large variety of possible circuit behaviors that would need to be simulated; it also has the disadvantage that it requires full knowledge of the details of the circuit attached to the grid, thereby precluding early verification of the grid. We propose a power grid verification technique that can be applied before the complete circuit has been designed and without exact knowledge of the circuit currents. We use current constraints, which are upper bound constraints on the currents that can be drawn from the grid, as a way to capture the uncertainty about the circuit details and activity. Based on this, we propose two solution approaches. One approach gives an upper-bound on the worst-case voltage drop at every node of the grid. Another, less expensive approach, applies a sufficient condition (thus, this becomes a conservative approach) to check if the drop on the grid exceeds a given voltage threshold.
  • Keywords
    RC circuits; circuit simulation; power grids; power supply circuits; circuit behavior; full-chip verification; power grid verification technique; sufficient condition; voltage drop; voltage integrity verification; voltage threshold; Algorithm design and analysis; Circuit simulation; Delay; Design automation; Permission; Power grids; Threshold voltage; Timing; Uncertainty; Upper bound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design, 2005. ISLPED '05. Proceedings of the 2005 International Symposium on
  • Print_ISBN
    1-59593-137-6
  • Type

    conf

  • DOI
    10.1109/LPE.2005.195521
  • Filename
    1522770