• DocumentCode
    2253298
  • Title

    Temperature control of CMOS micromachined sensors

  • Author

    Lakdawala, H. ; Fedder, G.K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2002
  • fDate
    24-24 Jan. 2002
  • Firstpage
    324
  • Lastpage
    327
  • Abstract
    In this paper, we describe a methodology for temperature stabilization of CMOS micromachined sensors. Temperature stabilization of a z-axis accelerometer, fabricated in a 0.5 /spl mu/m Agilent CMOS process is demonstrated. The accelerometer motion is sensed by a vertical comb drive designed by controlling the rotor and stator curvature. The polysilicon layer of the CMOS process has been utilized for heating the device structure to a constant temperature, that is higher than the maximum ambient operating temperature. The capacitance detection circuits have temperature independent gain. The D.C. bias stability of the accelerometer improved from 1.9 G//spl deg/C, to 42 mG//spl deg/C, and the sensitivity stability improved from 60% to 18% over a temperature of 70/spl deg/C after temperature control.
  • Keywords
    CMOS integrated circuits; accelerometers; capacitive sensors; compensation; microsensors; temperature control; 0.5 micron; Agilent CMOS process; CMOS micromachined sensors; DC bias stability; accelerometer motion; capacitance detection circuits; integrated heater design; polysilicon layer; rotor curvature control; sensitivity stability; stator curvature control; temperature control; temperature independent gain; temperature stabilization methodology; vertical comb drive; z-axis accelerometer; Accelerometers; CMOS process; Capacitance; Circuit stability; Heating; Motion control; Sensor phenomena and characterization; Stators; Temperature control; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7185-2
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2002.984268
  • Filename
    984268