Title :
A surface micromachined, out-of-plane anemometer
Author :
Chen, J. ; Jun Zou ; Chang Liu
Author_Institution :
Microelectron. & Nanotechnology Lab., Illinois Univ., Urbana, IL, USA
Abstract :
A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250/spl deg/C), hence the process can be realized on non-silicon, low-cost and flexible substrates. The time constant in constant-current mode is found to be below 50-/spl mu/s with a wire thickness of 1000 /spl Aring/ and wire length of 50-/spl mu/m.
Keywords :
anemometers; flow measurement; micromachining; microsensors; 1000 A; 250 C; 50 micron; 50 mus; constant-current mode time constant; flow sensors; low-cost flexible substrates; process temperature; sensing filament; surface micromachined out-of-plane hot-wire anemometer; surface micromachining; temperature coefficient of resistance; thermal response time; three-dimensional assembly; wind tunnel testing; wire length; wire thickness; Assembly; Costs; Fluid flow measurement; Frequency response; Micromachining; Platinum; Silicon; Substrates; Temperature sensors; Wire;
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-7185-2
DOI :
10.1109/MEMSYS.2002.984270