DocumentCode :
2253503
Title :
Low contact-force and compliant MEMS probe card utilizing fritting contact
Author :
Kataoka, K. ; Kawamura, S. ; Itoh, T. ; Suga, T. ; Ishikawa, K. ; Honma, H.
Author_Institution :
Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Japan
fYear :
2002
fDate :
24-24 Jan. 2002
Firstpage :
364
Lastpage :
367
Abstract :
We present a new MEMS probe card made of electroplated Ni micro-cantilevers, which has compliant structures, and uses a kind of electric breakdown, or fritting, to make electric contacts to electrodes on ICs. The characteristics of fritting contact between Ni probe and Al electrodes were investigated, and Ni was found to have lower contact resistance than other materials. A micro-machining process for the probe cards, including deposition of layers having different internal stress to make a protruding cantilever shape, was developed.
Keywords :
contact resistance; electric breakdown; electrical contacts; internal stresses; micromachining; micromechanical devices; probes; Al electrode; IC electrode; MEMS probe card; Ni probe; Ni-Al; compliant structure; contact force; contact resistance; electric breakdown; electric contact; electroplated Ni microcantilever; fritting contact; internal stress; micromachining process; Artificial intelligence; Breakdown voltage; Current measurement; Electric breakdown; Electrodes; Force control; Micromechanical devices; Needles; Probes; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-7185-2
Type :
conf
DOI :
10.1109/MEMSYS.2002.984278
Filename :
984278
Link To Document :
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