DocumentCode :
2253537
Title :
What is the metal role on the Fermi-level position at the interface with IV-IV compounds?
Author :
Aubry-Fortuna, V. ; Perrossier, J.-L. ; Mamor, M. ; Meyer, F. ; Frojdh, C. ; Thungstrom, G. ; Petersson, C.S. ; Bodnar, S. ; Regolini, J.L.
Author_Institution :
Inst. d´´Electron. Fondamentale, Univ. de Paris-Sud, Orsay, France
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
207
Lastpage :
209
Abstract :
The fabrication of IV-IV alloys has generated considerable interest. The possibility of band-gap engineering has made them attractive for devices such as HBTs, MODFETs and also infrared detectors. Recently, it was shown that small amounts of C added to S/sub 1-x/Ge/sub x/ layer can offer the possibility of strain compensation to zero misfit. A tetragonal distortion associated with either a compressive strain (usually present in strained Si/sub 1-x/Ge/sub x/ layer) or a tensile strain is also provided depending on the Ge:C ratio. In this present work, we have investigated the behavior of the Schottky barrier height (SBH) on these IV-IV alloys as a function of the composition of the alloy for different layer thicknesses (above or below the critical thickness), and as a function of the metal used to realize the Schottky contact.
Keywords :
Fermi level; Ge-Si alloys; Schottky barriers; energy gap; internal stresses; semiconductor materials; Fermi-level position; HBTs; MODFETs; Schottky barrier height; SiGe; band-gap engineering; compressive strain; infrared detectors; strain compensation; tensile strain; tetragonal distortion; zero misfit; Fabrication; MODFETs; Metallization; Photonic band gap; Schottky barriers; Silicon alloys; Sputtering; Telecommunications; Tensile strain; Titanium alloys;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1997.621125
Filename :
621125
Link To Document :
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