DocumentCode :
2253581
Title :
Removable tape using thermoplastic adhesive for QFN assembly process
Author :
Kawai, Toshiyasu ; Nagoya, Tomohiro ; Matsuura, Hidekazu
Author_Institution :
Hitachi Chem. Co. Ltd., Chiba, Japan
fYear :
2002
fDate :
2002
Firstpage :
190
Lastpage :
192
Abstract :
The miniaturization of IC packages is progressing rapidly with the increasing demand for mobile electronic equipment. In particular, the demand for the QFN (quad flat non-leaded package), a lead frame type CSP, is increasing now. The productivity of the QFN assembly process can become much higher by using the MAP (molded array packaging) technology. In that technology, QFN support tape is a key material. It needs not only to attach well to the backside of the lead frame to avoid flash burrs in molding, but also to be removed easily from the lead frame and the molding resin with no residue after molding. For this usage, we have developed a new thermoplastic adhesive by optimizing the chemical structure and the characteristics. The new thermoplastic adhesive has a high elastic modulus, low amount of outgassing, and enough adhesive strength at high temperatures. Therefore, our RT series QFN support tape reveals: (1) good wire bondability, (2) no flash burr in molding, and (3) no residue after removal. These tapes contribute more to high yield and high productivity in comparison with the conventional sticky adhesive tape in the QFN assembly process.
Keywords :
adhesives; chip scale packaging; elastic moduli; integrated circuit yield; lead bonding; moulding; plastic packaging; surface contamination; IC package miniaturization; MAP technology; QFN assembly process; QFN support tape; RT series QFN support tape; adhesive strength; chemical structure; elastic modulus; lead frame attachment; lead frame removal; lead frame type CSP; mobile electronic equipment; molded array packaging technology; molding flash burrs; molding resin; outgassing; process yield; productivity; quad flat nonleaded package; support tape residue; thermoplastic adhesive removable tape; wire bondability; Assembly; Chemicals; Chip scale packaging; Electronic equipment; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Packaging machines; Productivity; Resins;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Print_ISBN :
0-7803-7301-4
Type :
conf
DOI :
10.1109/IEMT.2002.1032750
Filename :
1032750
Link To Document :
بازگشت