Title :
Leadless sensor packaging for high temperature applications
Author :
Masheeb, F. ; Stefanescu, S. ; Ned, A.A. ; Kurtz, A.D. ; Beheim, G.
Author_Institution :
Kulite Semicond. Products Inc., Leonia, NJ, USA
Abstract :
This paper reports on a sensor packaging method suitable for high temperature applications. Its application for packaging a 6H-SiC pressure sensor is described. Electrical interconnects between the pressure sensor and the pins of the sensor header were made using a metal-glass frits mixture, without wirebonding. Packaged sensors were tested for pressures up to 1000 psi and at temperatures up to 500/spl deg/C.
Keywords :
high-temperature electronics; microsensors; pressure sensors; semiconductor device packaging; silicon compounds; wide band gap semiconductors; 1000 psi; 500 C; 6H-SiC pressure sensor; SiC; electrical interconnect; high temperature applications; leadless packaging; metal-glass frit mixture; Aircraft propulsion; Contacts; Etching; Glass; Internal combustion engines; Pins; Semiconductor device packaging; Temperature sensors; Testing; Thick films;
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-7185-2
DOI :
10.1109/MEMSYS.2002.984285
