Application of direct selective metal plating

This paper describes the application of a direct selective metal plating technology. A direct selective metal plating technology allows a growth of metal plating on a part where a seed material is drawn. A direct drawing method can be applied for various surfaces where it is not suitable for a conventional method based on a photolithography technology. A drawing system is constructed in order to apply the technology to three dimensional structure in this study. A fabrication of a multi layer circuit will be reported at first. Next, plating metal patterns on a various three dimensional structures will be demonstrated. Furthermore, plating a metal pattern on a ball will be reported. This result promises a possibility that a direct selective metal plating can also be applied to so called ball semiconductor technology at rather large scale.