DocumentCode :
2253834
Title :
Long-term testing of hermetic anodically bonded glass-silicon packages
Author :
Harpster, T.J. ; Najafi, K.
Author_Institution :
Center for Wireless Integrated Microsystems, Michigan Univ., Ann Arbor, MI, USA
fYear :
2002
fDate :
24-24 Jan. 2002
Firstpage :
423
Lastpage :
426
Abstract :
This paper reviews long-term test results obtained from a series of tests on glass-Si hermetically sealed packages. Results are presented from: 1) a 6.7-year ongoing room temperature phosphate buffered saline (PBS) soak test of 4 packages; 2) a 2.3-year ongoing in-vitro 97/spl deg/C PBS soak test of a single package; and 3) in-situ hermeticity and biocompatibility tests from 12 packages implanted in 4 guinea pigs - 3 packages implanted in each of 2 guinea pigs for 1-month and another 2 guinea pigs for 19-months, and 22-months. The long-term room temperature soak test is the longest running of any micropackage reported to date.
Keywords :
elemental semiconductors; glass; packaging; seals (stoppers); silicon; wafer bonding; 20 C; 97 C; MEMS technology; PBS soak test; Si; anodic bonding; biocompatibility; glass-silicon package; guinea pig; hermetic sealing; implantable microdevice; long-term testing; Actuators; Bonding; Electrodes; Glass; Hermetic seals; Integrated circuit packaging; Rough surfaces; Surface roughness; Temperature sensors; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-7185-2
Type :
conf
DOI :
10.1109/MEMSYS.2002.984293
Filename :
984293
Link To Document :
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