• DocumentCode
    2253835
  • Title

    Replacing global wires with an on-chip network: a power analysis

  • Author

    Heo, Seongmoo ; Asanovic, Krste

  • Author_Institution
    MIT Comput. Sci. & Artificial Intelligence Lab., Cambridge, MA, USA
  • fYear
    2005
  • fDate
    8-10 Aug. 2005
  • Firstpage
    369
  • Lastpage
    374
  • Abstract
    This paper explores the power implications of replacing global chip wires with an on-chip network. The authors optimized the network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. An analytic model of large chip designs with an on-chip two-dimensional mesh network was developed and the power savings possible in a 70 nm process for two different design points: a circuit-switched ASIC or FPGA design, and a dynamic packet-switched tiled architecture were estimated. For circuit-switched networks, achievable power savings are 35-50% for a mesh with 1 mm links. The packet switched designs use multiplexing and signal encoding to reduce the number of link wires required, but the router overhead limits peak wire power savings to around 20% with optimal tile sizes of around 2 mm.
  • Keywords
    circuit analysis computing; integrated circuit interconnections; network routing; network-on-chip; 1 mm; 70 nm; ASIC; FPGA; dynamic packet switched tiled architecture; energy reduction; global wires; link pipelining; multiplexing; network on chip; power analysis; repeater spacing; signal encoding; voltage scaling; Application specific integrated circuits; Chip scale packaging; Field programmable gate arrays; Mesh networks; Network-on-a-chip; Packet switching; Pipeline processing; Repeaters; Voltage; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design, 2005. ISLPED '05. Proceedings of the 2005 International Symposium on
  • Print_ISBN
    1-59593-137-6
  • Type

    conf

  • DOI
    10.1109/LPE.2005.195549
  • Filename
    1522798