DocumentCode
2253835
Title
Replacing global wires with an on-chip network: a power analysis
Author
Heo, Seongmoo ; Asanovic, Krste
Author_Institution
MIT Comput. Sci. & Artificial Intelligence Lab., Cambridge, MA, USA
fYear
2005
fDate
8-10 Aug. 2005
Firstpage
369
Lastpage
374
Abstract
This paper explores the power implications of replacing global chip wires with an on-chip network. The authors optimized the network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. An analytic model of large chip designs with an on-chip two-dimensional mesh network was developed and the power savings possible in a 70 nm process for two different design points: a circuit-switched ASIC or FPGA design, and a dynamic packet-switched tiled architecture were estimated. For circuit-switched networks, achievable power savings are 35-50% for a mesh with 1 mm links. The packet switched designs use multiplexing and signal encoding to reduce the number of link wires required, but the router overhead limits peak wire power savings to around 20% with optimal tile sizes of around 2 mm.
Keywords
circuit analysis computing; integrated circuit interconnections; network routing; network-on-chip; 1 mm; 70 nm; ASIC; FPGA; dynamic packet switched tiled architecture; energy reduction; global wires; link pipelining; multiplexing; network on chip; power analysis; repeater spacing; signal encoding; voltage scaling; Application specific integrated circuits; Chip scale packaging; Field programmable gate arrays; Mesh networks; Network-on-a-chip; Packet switching; Pipeline processing; Repeaters; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design, 2005. ISLPED '05. Proceedings of the 2005 International Symposium on
Print_ISBN
1-59593-137-6
Type
conf
DOI
10.1109/LPE.2005.195549
Filename
1522798
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