DocumentCode :
2253999
Title :
The use of pre-molded leadframe cavity package technologies in photonic and RF applications
Author :
Longford, Andy ; Radloff, Bob
Author_Institution :
PandA Eur., Lambourn, UK
fYear :
2002
fDate :
2002
Firstpage :
348
Lastpage :
352
Abstract :
The development of both Opto "photonic" and RF technology into silicon based chip solutions is creating a demand for smaller, more cost effective solutions to house the devices. The suppliers of various cavity package options are now developing new designs to meet the cost and volume production demands generated by these emerging industries. Ceramic based parts are being developed to provide more features and to match the needs of volume production equipments. LTCC parts can provide built-in circuit matching and are quickly customised. However, Thermoplastic mold compounds with pre-plated leadframes offer the most viable solutions for volume take-up at low cost. New approaches to design of application specific packages are used to show how matching function to environment can provide novel housing solutions but the capability to provide higher performance characteristics such as heat transfer and hermeticity in \´plastic\´ packaging remains the challenge for both RF and optical devices.
Keywords :
integrated circuit packaging; moulding; plastic packaging; RF technology; heat transfer; hermeticity; photonic technology; plastic packaging; pre-molded leadframe cavity package; silicon chip housing; thermoplastic mold compound; volume production; Ceramics; Circuits; Costs; Lead compounds; Packaging machines; Photonics; Plastic packaging; Production equipment; Radio frequency; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Print_ISBN :
0-7803-7301-4
Type :
conf
DOI :
10.1109/IEMT.2002.1032777
Filename :
1032777
Link To Document :
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