A solder self-assembled large angular displacement torsional electrostatic micromirror

Author

McCarthy, B. ; Bright, V.M. ; Neff, J.A.

Author_Institution

Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA

fYear

2002

fDate

24-24 Jan. 2002

Firstpage

499

Lastpage

502

Abstract

Solder self-assembled micromirrors have the advantages of rigid electrical and structural connections to the substrate as well as compact assembly mechanisms. In addition solder assembly allows a structure to be rotated to any angle desired. In this work, these advantages are used to produce a novel electrostatic micromirror that can stably rotate /spl plusmn/10/spl deg/ from its assembled position. The compact solder mechanism allows each of three mirror components to be assembled independently to individual angles. After assembly the design is statically tested and compared to both analytical and finite element (FE) model results.

Keywords

assembling; electrostatic devices; finite element analysis; micro-optics; mirrors; optical testing; soldering; angular displacement; compact assembly mechanisms; finite element model; mirror components; rigid electrical connections; rigid structural connections; solder self-assembled device; static testing; torsional electrostatic micromirror; Analytical models; Assembly; Electrodes; Electrostatics; Fasteners; Micromirrors; Mirrors; Self-assembly; Testing; Torque;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on

Conference_Location

Las Vegas, NV, USA

ISSN

1084-6999

Print_ISBN

0-7803-7185-2

Type

conf

DOI

10.1109/MEMSYS.2002.984318

Filename

984318