Title :
A solder self-assembled large angular displacement torsional electrostatic micromirror
Author :
McCarthy, B. ; Bright, V.M. ; Neff, J.A.
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
Solder self-assembled micromirrors have the advantages of rigid electrical and structural connections to the substrate as well as compact assembly mechanisms. In addition solder assembly allows a structure to be rotated to any angle desired. In this work, these advantages are used to produce a novel electrostatic micromirror that can stably rotate /spl plusmn/10/spl deg/ from its assembled position. The compact solder mechanism allows each of three mirror components to be assembled independently to individual angles. After assembly the design is statically tested and compared to both analytical and finite element (FE) model results.
Keywords :
assembling; electrostatic devices; finite element analysis; micro-optics; mirrors; optical testing; soldering; angular displacement; compact assembly mechanisms; finite element model; mirror components; rigid electrical connections; rigid structural connections; solder self-assembled device; static testing; torsional electrostatic micromirror; Analytical models; Assembly; Electrodes; Electrostatics; Fasteners; Micromirrors; Mirrors; Self-assembly; Testing; Torque;
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-7185-2
DOI :
10.1109/MEMSYS.2002.984318
