DocumentCode
2254218
Title
A two-step process for achieving an open test-development environment
Author
Lam, Hau
Author_Institution
Integrated Meas. Syst., Inc, Beaverton, OR, USA
fYear
2002
fDate
2002
Firstpage
403
Lastpage
406
Abstract
For many of today´s most advanced ICs and system-on-chip (SoC) devices, test costs have risen to as much as 50% of the total manufacturing cost. A major component of test cost is the time and resources required for test-program development. There are time-proven methods and test-development tools - both in-house and commercial - for translating a semiconductor device´s functional events and scan patterns (from EDA) into test programs for specific, targeted automated test equipment (ATE) platforms. However, in the face of increasing device complexity and new manufacturing requirements, methodologies and tool flows have begun to break down. This paper details the demands on test-development engineers that are created by today´s complex semiconductor devices, and outlines the set of solutions necessary to help speed these devices to market. Finally, this paper identifies areas to which the industry needs to apply additional work and resources.
Keywords
automatic test equipment; automatic test pattern generation; automatic test software; electronic design automation; integrated circuit design; integrated circuit economics; integrated circuit testing; system-on-chip; ATE-specific test programs; EDA; SoC; automated test equipment platforms; industry required test-development work/resources; manufacturing costs; open IC test-development environment process; scan patterns; semiconductor device complexity; semiconductor device functional events; system-on-chip devices; test costs; test patterns; test-development tools; test-program development; tool flows; Automatic testing; Costs; Electronic design automation and methodology; Manufacturing industries; Semiconductor device manufacture; Semiconductor device testing; Semiconductor devices; System testing; System-on-a-chip; Test equipment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Print_ISBN
0-7803-7301-4
Type
conf
DOI
10.1109/IEMT.2002.1032788
Filename
1032788
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