DocumentCode :
2254614
Title :
Design techniques for cross-layer resilience
Author :
Carter, Nicholas P. ; Naeimi, Helia ; Gardner, Donald S.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2010
fDate :
8-12 March 2010
Firstpage :
1023
Lastpage :
1028
Abstract :
Current electronic systems implement reliability using only a few layers of the system stack, which simplifies the design of other layers but is becoming increasingly expensive over time. In contrast, cross-layer resilient systems, which distribute the responsibility for tolerating errors, device variation, and aging across the system stack, have the potential to provide the resilience required to implement reliable, high-performance, low-power systems in future fabrication processes at significantly lower cost. These systems can implement less-frequent resilience tasks in software to save power and chip area, can tune their reliability guarantees to the needs of applications, and can use the information available at each level in the system stack to optimize performance and power consumption. In this paper, we outline an approach to cross-layer system design that describes resilience as a set of tasks that systems must perform in order to detect and tolerate errors and variation. We then present strawman examples of how this task-based design process could be used to implement general-purpose computing and SoC systems, drawing on previous work and identifying key areas for future research.
Keywords :
general purpose computers; logic design; optimisation; power consumption; reliability; system-on-chip; SoC systems; cross layer resilience design techniques; general purpose computing; performance optimize; power consumption; reliability; strawman examples; Aging; Circuits; Computer architecture; Costs; Energy consumption; Error correction; Error correction codes; Fabrication; Power system reliability; Resilience;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location :
Dresden
ISSN :
1530-1591
Print_ISBN :
978-1-4244-7054-9
Type :
conf
DOI :
10.1109/DATE.2010.5456960
Filename :
5456960
Link To Document :
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