DocumentCode
2254801
Title
Analysis of signal propagation in high-speed differential signal lines with full-wave time-domain technique
Author
Yuan, Weiliang ; Li, Er-Ping
Author_Institution
CEE Div., Inst. of High Performance Comput., Singapore, Singapore
Volume
2
fYear
2002
fDate
19-23 Aug. 2002
Firstpage
1004
Abstract
With the advancements in electronics, interests in interconnect of high-speed digital circuits and IC packaging have greatly increased in EMC community for signal integrity (SI). However, in order to take complex electromagnetic effects such as radiation, reflection and coupling into account, full-wave numerical techniques must be resorted, which usually result in intensive computation. This paper presents the investigation in electrical performance of differential signaling transmission lines, an increasingly used high-speed interconnect, by using the finite-difference time-domain (FDTD) method. The MPI-based parallel FDTD implementation is firstly discussed and a simple FDTD thin sheet algorithm is considered for imperfectly conductive strip lines. The characteristic impedance of, current distributions in, the reflection from the termination in, the effects of through via in, and the radiation from differential signal lines for even and odd modes are then investigated. The deep insights acquired is useful to optimize interconnect designs with differential signaling transmission lines for SI and EMC purposes.
Keywords
current distribution; digital integrated circuits; electromagnetic compatibility; electromagnetic interference; finite difference time-domain analysis; integrated circuit packaging; transmission line theory; EMC; EMI; FDTD thin sheet algorithm; IC packaging; differential signaling transmission lines; finite-difference time-domain method; high-speed digital circuits; high-speed interconnects; imperfectly conductive strip lines; signal integrity; termination; via; Digital circuits; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic propagation; Electromagnetic radiation; Finite difference methods; Integrated circuit interconnections; Signal analysis; Time domain analysis; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location
Minneapolis, MN, USA
Print_ISBN
0-7803-7264-6
Type
conf
DOI
10.1109/ISEMC.2002.1032833
Filename
1032833
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