Application of higher-order FEM elements to the analysis of microstrip structures

Author

Wang, H. ; Guo, C.L. ; Hubing, T.H. ; Drewniak, J.L. ; Van Doren, T.P. ; DuBroff, R.E.

Author_Institution

Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA

Volume

2

fYear

2002

fDate

19-23 Aug. 2002

Firstpage

1015

Abstract

Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.

Keywords

finite element analysis; method of moments; microstrip lines; substrates; Whitney elements; dielectric substrate; electromagnetic modeling; higher-order FEM elements; linear-tangent/linear-normal tangential vector finite elements; mesh methods; method of moments; microstrip structures analysis; Application software; Circuits; Dielectric substrates; Electromagnetic modeling; Finite element methods; Impedance; Message-oriented middleware; Microstrip; Solid modeling; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on

Conference_Location

Minneapolis, MN, USA

Print_ISBN

0-7803-7264-6

Type

conf

DOI

10.1109/ISEMC.2002.1032835

Filename

1032835