DocumentCode
2255457
Title
Exploiting local logic structures to optimize multi-core SoC floorplanning
Author
Li, Cheng Hong ; Sonalkar, Sampada ; Carloni, Luca P.
Author_Institution
Dept. of Comput. Sci., Columbia Univ. in the City of New York, New York, NY, USA
fYear
2010
fDate
8-12 March 2010
Firstpage
1291
Lastpage
1296
Abstract
We present a throughput-driven partitioning algorithm and a throughput-preserving merging algorithm for the high-level physical synthesis of latency-insensitive (LI) systems. These two algorithms are integrated along with a published floorplanner [5] in a new iterative physical synthesis flow to optimize system throughput and reduce area occupation. The partitioning algorithm performs bottom-up clustering of the internal logic of a given IP core to divide it into smaller ones, each of which has no combinational path from input to output and thus is legal for LI-interface encapsulation. Applying this algorithm to cores on critical feedback loops optimizes their length and in turn enables throughput optimization via the subsequent floorplanning. The merging algorithm reduces the number of cores on non-critical loops, lowering the overall area taken by LI interfaces without hurting the system throughput. Experimental results on a large system-on-chip design show a 16.7% speedup in system throughput and a 2.1% reduction in area occupation.
Keywords
circuit layout; encapsulation; optimisation; system-on-chip; IP core; LI interface encapsulation; bottom up clustering; iterative physical synthesis flow; latency insensitive systems; local logic structures; multicore SoC floorplanning optimization; throughput driven partitioning algorithm; throughput preserving merging algorithm; Clustering algorithms; Encapsulation; Feedback loop; Iterative algorithms; Law; Legal factors; Logic; Merging; Partitioning algorithms; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location
Dresden
ISSN
1530-1591
Print_ISBN
978-1-4244-7054-9
Type
conf
DOI
10.1109/DATE.2010.5457005
Filename
5457005
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