• DocumentCode
    2255571
  • Title

    SiC bipolar transistors for RF applications

  • Author

    Perez-Wurfl, I. ; Krutsinger, R. ; Torvik, J.T. ; Zeghbroeck, B. Van

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    2
  • Lastpage
    4
  • Abstract
    The wide bandgap (WBG) semiconductor SiC has been identified as a potential candidate for use in high power and high frequency devices due to its superior material parameters. SiC has a breakdown field almost six times higher than that of Si or GaAs resulting in a higher attainable power density. SiC has a larger thermal conductivity, 3 times that of Si and 6 times that of GaAs, translating into a smaller chip size and, therefore, more efficient systems. To date, most research on SiC RF devices has focused on majority carrier devices such as SITs and MESFETs. There are only a few reports on SiC bipolar transistors and these studies have concentrated on SiC power switching transistors. Bipolar transistors have potentially superior linearity as well as higher current handling and power density capabilities compared to the aforementioned RF devices making BJTs ideal for use in power amplifiers.
  • Keywords
    UHF bipolar transistors; current density; microwave bipolar transistors; microwave power transistors; power bipolar transistors; semiconductor device breakdown; silicon compounds; wide band gap semiconductors; 4H-SiC BJTs; DC power dissipation density; SiC; SiC bipolar transistors; breakdown field; elevated temperatures; emitter current density; fabrication; high frequency devices; high power density handling ability; high-power RF applications; highly-doped base layer; n-type 4H-SiC substrate; testing; thermal conductivity; wide bandgap semiconductor; Bipolar transistors; Conducting materials; Electric breakdown; Gallium arsenide; Photonic band gap; Radio frequency; Radiofrequency identification; Semiconductor materials; Silicon carbide; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2001 International
  • Print_ISBN
    0-7803-7432-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2001.984424
  • Filename
    984424